In the manufacturing world, the word “retrofit” many times is feared to mean “lost production.” In other words, plants—or at least parts of plants—must be shut down for equipment to be upgraded. And ...

Advanced packaging is transforming semiconductor manufacturing into a multi-dimensional challenge, blending 2D front-end wafer fabrication with 2.5D/3D assemblies, high-frequency device ...

As chips evolve toward stacked, heterogeneous assemblies and adopt more complex materials, engineers are grappling with new and often less predictable sources of variation. This is redefining what it ...