Large Language Models (LLM) challenges: The emergence of large language models (LLMs) marks a milestone in AI, revolutionizing natural language processing (NLP) and related fields. Models like ...
2.5D and 3D packaging technology: The 2.5D and 3D packaging technologies encompass various packaging techniques. In 2.5D packaging, the choice of interposer material categorizes it into Si-based, ...
Wafer level integration encompasses fan-in, core fan-out, high-density fan-out, 2.5D IC, and 3D IC packaging technologies. However, only those with a bumping pitch size of less than 100 µm are ...
Semiconductors are the critical component that enables our digital life. Their development has come a long way; In 1971, the Intel 4004, which was the first single-chip processor, had just 2,250 ...
If the future were to be categorized in one word, it would be "data-centric". For decades, IC vendors have designed chips that have all functions integrated on the same die; however, scaling ...
The need for a circular economy has never been so urgent. Plastic consumption is expected to double globally by 2050, creating environmental and human health risks. Not only is plastic waste ...
Advanced semiconductor packaging technologies are crucial due to the slowing of Moore's law and rising costs of monolithic Si IC development and manufacturing. Initially, components were individually ...
Advanced semiconductor packaging technologies are crucial due to the slowing of Moore's law and rising costs of monolithic Si IC development and manufacturing. Initially, components were individually ...
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