With the continued need for shrinking pattern dimensions, semiconductor manufacturers continue to implement more complex patterning techniques, such as advanced multi-patterning, for the 10nm design ...
New integration and patterning schemes used in 3D memory and logic devices have created manufacturing and yield challenges. Industrial focus has shifted from the scaling of predictable unit processes ...
Manufacturing has gone through a series of major evolutions in the past few years. Subtractive processes (drilling, cutting, CNC milling and turning) and standard formative techniques (injecting, ...
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