Abstract: Design of the extremely high-temperature, up to 815 °C, piezoelectric accelerometer with extended frequency bandwidth is presented in this letter. The accelerometer incorporates a ...
Abstract: Because of the wide application of die top interconnects with Cu bonding wire, the weak points in SiC MOSFET power modules presented a huge difference compared to the conventional modules ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback