COMSOL Multiphysics software lets you model just about anything from electromagnetic fields to structural mechanics and chemical reactions. While many of its capabilities fall outside the interest to ...
The latest version of the multiphysics simulation software introduces GPU acceleration through NVIDIA's CUDA® direct sparse solver, the Granular Flow Module and time-explicit structural dynamic ...
COMSOL Multiphysics® version 6.4 introduces new and updated functionality as well as the new Granular Flow Module, based on the discrete element method (DEM), for simulating grain and powder flow. The ...
Multiphysics simulation allows engineers to evaluate complex interactions in a single environment, reducing the need for physical prototypes. In healthcare, simulation helped design electromagnetic ...
Multiphysics simulation helps engineers understand the interaction of thermal, structural, acoustic, fluid, and electromagnetic effects in complex systems. Accurate material properties are crucial; ...
Many technologies rely on electric discharge phenomena, including consumer electronics, medical devices, and high-voltage power systems. During product development, it is highly beneficial to simulate ...
COMSOL Multiphysics is a comprehensive simulation software platform that enables engineers and scientists to model and analyze multidisciplinary physical systems. By integrating multiple fields of ...
Git isn’t hard to learn. Moreover, with a Git GUI such as Atlassian’s Sourcetree, and a SaaS code repository such as Bitbucket, mastery of the industry’s most powerful version control tools is within ...
The high power consumption of electronic systems, driven by applications in Artificial Intelligence (AI) and High-Performance Computing (HPC), is generating a significant demand to address overheating ...
BURLINGTON, Mass., Nov. 19, 2024 (GLOBE NEWSWIRE) -- COMSOL, a global leader in modeling and simulation software, today announced the release of COMSOL Multiphysics® version 6.3, which delivers new ...
3D integrated circuits (3D ICs) are emerging as a revolutionary approach to design, manufacturing and packaging in the semiconductor industry. Offering significant advantages in size, performance, ...