Abstract: The traditional design is achieved by the iterative simulation using finite element method (FEM) software and relies on the experts’ experience, so the design parameters cannot be ...
Abstract: Copper-filled via is a critical component of advanced electronic packaging technologies. Embedded in interposer substrate, vias provide enhanced electrical performance in 2.5-D and 3-D ...
You might be staring at your budget, wondering how you’re supposed to cover rent, debt, and everything else on $20–$25 an ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback