IEEE

An Experimental Study on a Barrier-Less Cu Interconnect Scheme With Polyimide Insulator for Cost-Effective 3-D Packaging

Abstract: Polyimide (PI) has been widely used as the insulator material in the Cu interconnect system for 3-D advanced packaging. In general, a barrier layer is required between PI and Cu to suppress ...
IEEE

Future Design Direction for SRAM Data Array: Hierarchical Subarray With Active Interconnect

Abstract: In sub 10 nm nodes, the growing dominance of interconnects in chips poses challenges in designing large-size static random-access memory (SRAM) subarrays. The main issue is the write failure ...